Global Background

Terms & Conditions

1. Acceptance of Terms

Welcome to CH Mobile & Institute. By accessing our platform, utilizing our repair services, or enrolling in our clinical laboratory training program, you agree to comply with and be bound by the following terms and conditions. If you disagree with any part of these terms, please do not use our services.

2. Educational Services & Institute Rules

Our Institute provides high-level micro-soldering and diagnostic education. By enrolling:

  • You agree to follow all safety protocols, especially regarding ESD (Electrostatic Discharge) and lab equipment.
  • You acknowledge that course completion certificates are awarded strictly based on merit, practical exams, and attendance.
  • You must respect intellectual property. Distributing proprietary schematics or CH Mobile diagnostic materials given during training is strictly prohibited.

3. Technical Repair Liabilities

When you submit a device for hardware restoration:

  • Data Loss: We are not responsible for data loss during complex motherboard repairs. It is your responsibility to back up data.
  • Dead Risk: Advanced repairs (CPU/NAND reballing, logic board bridging) carry an inherent risk of complete device failure. By submitting a device, you acknowledge this risk.
  • Warranty: Components we install covered by a specific warranty period will be stated on your invoice. Liquid damage or physical damage post-repair automatically voids this warranty.

4. Engineering Store & Parts

Items purchased via our online presence or physically are tested prior to sale. Any returned parts must be in original condition with our lab stamps intact. We do not accept returns on components damaged by incorrect installation.

5. Governing Law

These terms shall be governed by and construed in accordance with the laws of Pakistan. Any disputes arising in relation to these terms shall be subject to the jurisdiction of the courts of Gujranwala.

Last Revised: May 19, 2026